Nano 3D Optical Surface Profilometers SuperView W3

Dedicated Functions for Semiconductor Field

Measure profile trenches after laser grooving in the dicing process.
Measure film step-height of wafer ranging from 1nm~1mm.
Measure roughness of silicon cut sheet after grinding process, and can measure dozens of small areas to obtain the average value by one click.
Support 6", 8" and 12" wafer measurement, and easy switch between 3 sizes of vacuum chucks by one click automatically.

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§≡≡≡≡ Description ≡≡≡≡

SuperView W3 Optical 3D Surface profilometer is an ideal instrument for sub-Nanometer measurement of various precision parts. Based on the principle of white light interference technology, combined with precision Z-direction scanning module and 3D modeling algorithm, it contactlessly scans the surface of the object then establish a 3D image for the surface. A serial of 2D, 3D parameters reflecting surface quality of the object are obtained after XtremeVision software processes and analyzes the 3D image.

The SuperView W3 is a user-friendly precision optical instrument with powerful analysis functions for all kinds of surface form & roughness parameters. With unique light source it could measure various precision parts with both smooth and rough surface.

§≡≡≡≡ Parameters ≡≡≡≡

Model No.		SuperView W3
Size		(1000x900x1500)mm
Weight		500kg
Light Source		White LED
Video System		1024x1024
Objective Lens		10X,(2.5X,5X,20X,50X,100X)
Optical Zoom		0.5X,(0.75X,1X,0.375X)
Standard F.O.V.		0.98x0.98mm
Lens Turret		Motorized 5 holes turret
XY Object Table	Size	450x450mm
	Travel Range	300x300mm
	Load Capacity	10kg
	Control Method	Motorized
Tilt		±6°Motorized
Z Axis	Travel Range	100mm
	Control Method	Motorized
Z- Stroke Scanning Range		10mm
Z Resolution		0.1nm
Reflectivity of Object		0.05%~100%
Roughness RMS Repeatability*1		0.005nm
Step Height Measurement	Accuracy*2	0.3%
	Repeatability*2	0.08% 1ϭ
Environmental requirement
1.Operating environment: No strong magnetic field		4.Environmental vibration: VC-C or better
2.Working temperature: 15°C~30°C fluctuation <2℃/60min		5.Compressed air: 0.6Mpa oil-free, water-free
3.Relative humidity: 5%~95% RH, no condensation		6.Power: 330W
1 Measure Sa 0.2nm silicon wafer in a laboratory environment according to the ISO 25178 2 Measure standard 4.7μm steps height block in a laboratory environment according to the ISO 5436-1:2000

Remark: Performance parameters are tested by using a 4.7µm precision master stage gauge in lab according to ISO 4287 and ISO 25178.

Zoom ratio of lens			2.5×	5×	10×	20×	50×	100×
Numerical hole diameter			0.075	0.13	0.3	0.4	0.55	0.7
Optical resolution @550nm(µm)			3.7	2.1	0.92	0.69	0.5	0.4
Depth of focus(µm)			48.6	16.2	3.04	1.71	0.9	0.56
Working distance(mm)			10.3	9.3	7.4	4.7	3.4	2.0
Field H×V (mm)	Video system 1024×1024	0.5×	3.92×3.92	1.96×1.96	0.98×0.98	0.49×0.49	0.196×0.196	0.098×0.098
		0.75×	2.6×2.6	1.3×1.3	0.65×0.65	0.325×0.325	0.13×0.13	0.065×0.065
		1×	1.96×1.96	0.98×0.98	0.49×0.49	0.245×0.245	0.098×0.098	0.049×0.049

※ Built-in ISO/ASME/EUR/GBT Standards of 2D, 3D parameters:

2D Parameters

Standard	Parameters
ISO 4287-1997		>Principal section	Roughness	>Waviness
	>Amplitude	Pp, Pv ,Pz, Pc, Pt,Pa,Pq,Psk,Pku	Rp, Rv ,Rz, Rc, Rt,Ra,Rq,Rsk,Rku	Wp, Wv ,Wz, Wc, Wt,Wa,Wq,Wsk,Wku
	interval	PSm,Pdq	RSm,Rdq	WSm,Wdq
	>Substance	Pmr,Pdc	Rmr,Rdc,Rmr(Rz/4)	Wmr,Wdc,Wmr(Wz/4)
	Peak	PPc	RPc	WPc
ISO 13565	ISO 13565-2	Rk,Rpk,Rvk,Mr1,Mr2,A1,A2,Rpk,Rvk
ISO 12085	Roughness graph	R,AR,R× ,Nr
	>Waviness graph	W,AW,W×,Wte
	Other graph	Rke,Rpke,Rvke
AMSE B46.1	2D	Rt,Rp,Rv,Rz,Rpm,Rma×,Ra,Rq,Rsk,Rku,tp,Htp,Pc,Rda,Rdq,RSm,Wt
DIN EN ISO 4287-2010	Original profile	Pa,Pq,Pp,Pv,Pz,Pc,Pt,PSk,PKu,PSm,PPc,Pdq,Pdc,Pmr,
	Roughness	Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,RPc,Rdq,Rdc,Rmr,
	>Waviness	Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr
JIS B0601-2013	Original profile	Pa,Pq,Pp,Pv,Pz,Pc,Pt,PSk,PKu,PSm,PPc,Pdq,Pdc,Pmr,
	Roughness	Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,Rdq,Rdc,Rmr
	>Waviness	Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr
GBT 3505-2009	Original profile	Pa,Pq,Pp,Pv,Pz,Pc,Pt,PSk,PKu,PSm,PPc,Pdq,Pdc,Pmr,
	Roughness	Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,Rdq,Rdc,Rmr
	>Waviness	Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr

3D Parameters

Standard	Parameters
ISO 25178	Height	Sq,Ssk,Sku,Sp,Sv,Sz,Sa
	function	Smr,Smc,S×p
	Space	Sal,Str,Std
	Composite parameters	Sdq,Sdr
	Volume	Vm,Vv,Vmp,Vmc,Vvc,Vvv
	Form	Spd,Spc,S10z,S5p,S5v,Sda,Sha,Sdv,Shv
	Functional	Sk,Spk,Svk,Smr1,Smr2,Spq,Svq,Smq
ISO 12781	Flatness	FLTt,FLTp,FLTv,FLTq
EUR 15178N	>Amplitude	Sa,Sq,Sz,Ssk,Sku,Sp,Sv,St
	Space	Str,Std,Sal
	Composite parameters	Sdq,Sds,Ssc,Sdr,Sfd
	Area, Volume	Smr,Sdc
	Function	Sk,Spk,Svk,Sr1,Sr2,Spq,Svq,Smq
	Functional	Sbi,Sci,Svi
EUR 16145 EN	>Amplitude	Sa , Sq ,Sy,Sz,Ssk,Sku
	Mixed parameters	Ssc,Sdq,Sdr
	Functional	Sbi,Sci,Svi,Sk,Spk,Svk
	Space	Sds,Std,Stdi,Srw,Srwi
	Hardness	Hs,Hvol,Hv,Hps,Hpvol,Hpv,Hap,Hbp
ASME B46.1	3D	St,Sp,Sv,Sq,Sa,Ssk,Sku,SWt

§≡≡≡≡ Applications ≡≡≡≡

It is used for measurement and analysis of surface roughness and profile of precision components from industries of semi-conductor, 3C Electronics, ultraprecise machining, optical machining, micro-nano materials, micro-electro-mechanical system.

Measurement and analysis for various products, components and materials`surface form and profile characteristics, such as flatness, roughness, waviness, appearance, surface defect, abrasion,corrosion, gap, hole, stage, curvature, deformation, etc.

3C Electronics_Sapphire crystal

3C Electronics _ Ink screen

Dedicated Functions for Semiconductor Field

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