Flash Measuring Machine VX8300
  • Item No.: VX8300
    Product name: Flash Measuring Machine
  • Image Senor: 20M CMOS
  • Field of view:W230mm×L130mm & W300mm×L200mm
    Depth of Field: 3mm & 30mm
    Working Distance: 120mm
    Accuracy: ±1.5μm(Without stitching) &  ±3μm(Without stitching) 
    Resolution: 0.1μm
    Loading Capacity: 5kg
    Size(LxWxH): 531×503×731mm
    Weight: 75kg

 

details

§≡≡≡≡  Description  ≡≡≡≡
Based on visual measurement principle with precision image analysis algorithms, equipped with double telecentric optical lens with high depth of field, VX8000 series of Flash Measuring Machines achieve fast dimensional measurement by one-key operation. VX8000 series are suitable for precise dimensional measurement in the fields of machinery, electronics, molds, injection molding, hardware, rubber, low-voltage electrical appliances, magnetic materials, precision stamping, connectors, connectors, terminals, mobile phones, home appliances, printed circuit boards, medical equipment, watches, cutting tools, etc.
 
 
§≡≡≡≡  Parameters  ≡≡≡≡
 
Model VX8300
Image Senor 20M CMOS
Monitor Built-in 10.4" LCD (XGA:1024×768)
Outside 24" LCD (XGA:1920×1080)
Acceptance Lens Object Space Telecentric Lens
Light Ring Four-segment illumination(White Light/Green Light)
Bottom Telecentric transmission illumination(Green Light)
Field of View Large field 300mm×200mm(4 Angle R50)
High precision 230mm×130mm
Resolution 0.1um
Repeatability
of Image Meas.
Large field Without Stitching*1 ±1um
With Stitching*2 ±2um
High precision Without Stitching*1 ±0.5um
With Stitching*2 ±1.5um
Accuracy
of Image Meas.
Large field Without Stitching*1 ±3um
With Stitching*2 ±(5+0.02L)μm
High precision Without Stitching*1 ±1.5um
With Stitching*2 ±(3+0.02L)μm
Horizontal
Rotary Unit
(Optional)
Rotation Angle Range 360°, Resolution 0.01°
Rotation Speed 0.2~2rev/s
Max Diameter Φ60mm
Height Meas.
(Optical probe)
(Optional)
Measuring Range(XY) 120mm×110mm
Max Hole-Depth Ratio(h/φ) 1.5
Dia. of Beam Φ38μm
Resolution 0.25μm
Z Non-movement Range(Z) ±3.5mm
Accuracy ±2μm
Z Movement Range(Z) 70mm
Accuracy ±(6+0.01H)μm, H is Z moving height in mm
Software VisionX
XY Object Table X Travel range 210mm(Motorized)
Y Travel range 110mm(Motorized)
Loading Capacity 5kg
Z-Axis Travel range 75mm(Motorized)
Size(LxWxH) (531×503×731)mm
Weight 75kg
Input AC100~240V/50~60Hz
Working Environment Temp.10~35, Humidity 30%80%, Vibration<0.002g, Less than15Hz
 
Remark:
 *1 In the focus position, the environment temperature is +20 °C ± 1.0 °C
*2 In the focus position, the environment temperature is +20 °C ± 1.0 °C, and the load on the table is 2 kg or less; L is the moving range of the table (mm)
 
 
§≡≡≡≡  Applications  ≡≡≡≡
VisionX software provides up to 80 extraction analysis tools, including [Feature Extraction] (such as maximum points, centerlines, arcs, peaks, etc.), [Accessory Tools] (such as any dot & line & circle, fitted straight line, Fit circle, tangent, inscribed circle, etc.), [Smart Labeling], [shape tolerance] , special [Application Tool] (such as pitch distance, pitch angle, slot, thread, round cross, down Angle, rounded corners, etc.)
The measurement results and their main statistical values (such as average, σ, 3σ, 6σ, Ca, Cp, Cpk, etc.) will be automatically recorded and archived. Operators can select different filter conditions for history extraction.

 

§≡≡≡≡  Stratistics  ≡≡≡≡

The trend graph displays the regular trend of the measured values, such as the monotonic and periodic change of the measured values, which can be used for monitoring the abnormality of the production process of producing equipment. Reflecting the status and distribution of fluctuations in product quality, the histogram can intuitively expose information about the quality situation in producing process, which can be used to predict product quality and failure rate.
Through quality diagnosis and analysis with statistical methods, SPC can monitor the product quality and changing trend of the producing process. With SPC we can find the preventive solution in the producing process, so that the subsequent inspection and repair are reduced. Consequently, the producing process control and product quality improvement are achieved.

 

§≡≡≡≡  More Applications  ≡≡≡≡

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