Flash Measuring Machine VX3200D
  • Item No.: VX3200D
    Product name: Flash Measuring Machine
  • Image Senor: 5M CMOS
  • Field of view:W130mm×L130mm & W200mm×L200mm
    Depth of Field: 3mm & 30mm
    Working Distance: 120mm
    Accuracy: ±2μm(Without stitching) &  ±5μm(Without stitching) 
    Resolution: 0.1μm
    Loading Capacity: 5kg
    Size(LxWxH): 531×386×731mm
    Weight: 49kg

 

details

§≡≡≡≡  Description  ≡≡≡≡
Based on visual measurement principle with precision image analysis algorithms, equipped with double telecentric optical lens with high depth of field, VX3000 series of Flash Measuring Machines achieve fast dimensional measurement by one-key operation. VX3000 series are suitable for precise dimensional measurement in the fields of machinery, electronics, molds, injection molding, hardware, rubber, low-voltage electrical appliances, magnetic materials, precision stamping, connectors, connectors, terminals, mobile phones, home appliances, printed circuit boards, medical equipment, watches, cutting tools, etc.
 
 
 
 
§≡≡≡≡  Parameters  ≡≡≡≡
 
Model VX3200 VX3200D
Image Senor 5M CMOS
Monitor Built-in 10.4" LCD (XGA:1024×768)
  Outside 24" LCD (XGA:1920×1080)
Acceptance Lens Object Space Telecentric Lens
Light Ring Four-segment illumination(White Light/Green Light)
Bottom Telecentric transmission illumination(Green Light)
Field of View Large field 200mm×200mm(4 Angle R50) 200mm×200mm(4 Angle R50)
High precision / 130mm×130mm
Repeatability
of Image Meas.
Large field Without Stitching*1 ±1um ±1um
With Stitching*2 ±2um ±2um
High precision Without Stitching*1 / ±0.5um
With Stitching*2 / ±1.5um
Accuracy
of Image Meas.
Large field Without Stitching*1 ±5um ±5um
With Stitching*2 ±(7+0.02L)μm ±(7+0.02L)μm
High precision Without Stitching*1 / ±2um
With Stitching*2 / ±(4+0.02L)μm
Height Meas.
(Physical Probe)
(Optional)
Measuring Range(X*Y) 60*110mm
Max Depth 75mm
Dia. of Probe Φ1mm
Measuring Force 0.13N
Repeatability*3 ±3μm
Accuracy*4 ±(7.5+0.02L)μm
Software VisionX
Resolution 0.1um
XY Object Table X Travel range 110mm(Motorized)
Y Travel range 110mm(Motorized)
Loading Capacity 5kg
Z-Axis Travel range 75mm(Motorized)
Size(LxWxH) (531×368×731)mm
Weight 48kg 49kg
Input AC100~240V/50~60Hz
Working Environment Temp.10℃~35℃, Humidity 30%~80%, Vibration<0.002g, Less than15Hz
 
Remark:
 *1 In the focus position, the environment temperature is +20 °C ± 1.0 °C
*2 In the focus position, the environment temperature is +20 °C ± 1.0 °C, and the load on the table is 2 kg or less; L is the moving range of the table (mm)
*3 Repeatability ±3μm in 80% measuring area
*4 The environment temperature is +20 °C ± 1.0 °C, and the load on the table is 2 kg or less; L is the moving range of the table (mm)
 
 
§≡≡≡≡  Applications  ≡≡≡≡
VisionX software provides up to 80 extraction analysis tools, including [Feature Extraction] (such as maximum points, centerlines, arcs, peaks, etc.), [Accessory Tools] (such as any dot & line & circle, fitted straight line, Fit circle, tangent, inscribed circle, etc.), [Smart Labeling], [shape tolerance] , special [Application Tool] (such as pitch distance, pitch angle, slot, thread, round cross, down Angle, rounded corners, etc.)
The measurement results and their main statistical values (such as average, σ, 3σ, 6σ, Ca, Cp, Cpk, etc.) will be automatically recorded and archived. Operators can select different filter conditions for history extraction.

 

§≡≡≡≡  Stratistics  ≡≡≡≡

The trend graph displays the regular trend of the measured values, such as the monotonic and periodic change of the measured values, which can be used for monitoring the abnormality of the production process of producing equipment. Reflecting the status and distribution of fluctuations in product quality, the histogram can intuitively expose information about the quality situation in producing process, which can be used to predict product quality and failure rate.
Through quality diagnosis and analysis with statistical methods, SPC can monitor the product quality and changing trend of the producing process. With SPC we can find the preventive solution in the producing process, so that the subsequent inspection and repair are reduced. Consequently, the producing process control and product quality improvement are achieved.

 

§≡≡≡≡  More Applications  ≡≡≡≡

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