SuperView W1 Optical 3D Surface profilometer is an ideal instrument for sub-Nanometer measurement of various precision parts. Based on the principle of white light interference technology, combined with precision Z-direction scanning module and 3D modeling algorithm, it contactlessly scans the surface of the object then establish a 3D image for the surface. A serial of 2D, 3D parameters reflecting surface quality of the object are obtained after XtremeVision software processes and analyzes the 3D image. The SuperView W1 is a user-friendly precision optical instrument with powerful analysis functions for all kinds of surface form & roughness parameters. With unique light source it could measure various precision parts with both smooth and rough surface.
Model No. | SuperView W1 | SuperView W1-Pro | |
Light source | White LED | ||
Video system | 1024×1024 | ||
Standard Field of View | 0.98×0.98 mm | ||
Max Field of View | 6.0×6.0 mm(Optional) | ||
Lens Turret | Manual 3 holes turret(Optional: Motaorized 5 holes turret) | ||
XY Object table | Size | 320×200mm | 300×300mm |
Moving range | 140×100mm | 200×200mm | |
Loading capacity | 10kg | ||
Control method | Motorized | ||
Tilt | ±5° | ||
Z Axis | Tracvel range | 100mm | |
Control method | Motorized | ||
Z Stroke Scanning range | 10mm | ||
Surface Form Repeaability*2 | 0.1nm | ||
Roughness RMS Repeatability*3 | 0.005nm | ||
Step Hiehgt Measurementy*4 | Accuracy: 0.3% Repeatability: 0.008%(1σ) | ||
Scanning Speed @0.1nm resulution | 1.85μm/s | ||
Reflectivity of Test Object | 0.05%~100% | ||
Size(L*W*H) | 700x606x920mm | ||
Weight | <160kg | ||
Operating Environment | Temperature | 15°C~30°C, fuctuation <1°C/15min | |
Humidity | 5%~95% RH, no condensation | ||
Vibration | VC-C or better | ||
Software Noise Evaluation*5 | 3σ≤4nm | ||
Compressed Air | 0.6Mpa oil-free, water-free, 6mm diameter of hose | ||
Power Supply | AC100~240V, 50/60Hz, 4A, 300W | ||
Other | No strong magnetic field, No corrosive gas | ||
*1 W1 is the standard model of 3D Optical Surface Profilometer; W1-pro has larger stage size and travel range. W1-Ultra has greatly improved the scanning speed compared to W1. *2 Use EPSl mode to measure Sa 0.2nm silicon wafer in the laboratory environment; Single stripe, 80um filter for full field of view *3 Measure Sa 0.2nm silicon wafer in a laboratory environment according to the ISO 25178. *4 Measure standard 4.7μm steps height block in a laboratory environment according to the ISO 5436-1:2000 *5 When the software noise evaluation is 4nm≤3σ≤10nm, the Roughness RMS repeatability is revised down to 0.015nm, the Step height measurement accuracy is revised down to 0.7%, and the step height measurement repeatability is revised down to 0.12%; When the software noise evaluation is 3σ>10nm, the environment does not meet the requirement for usage of the equipment, and need to change the site. |
Remark: Performance parameters are tested by using a 4.7µm precision master stage gauge in lab according to ISO 4287 and ISO 25178.
Zoom ratio of lens |
2.5× |
5× |
10× |
20× |
50× |
100× |
||
Numerical hole diameter |
0.075 |
0.13 |
0.3 |
0.4 |
0.55 |
0.7 |
||
Optical resolution @550nm(µm) |
3.7 |
2.1 |
0.92 |
0.69 |
0.5 |
0.4 |
||
Depth of focus(µm) |
48.6 |
16.2 |
3.04 |
1.71 |
0.9 |
0.56 |
||
Working distance(mm) |
10.3 |
9.3 |
7.4 |
4.7 |
3.4 |
2.0 |
||
Field H×V (mm) |
Video system 1024×1024 |
0.5× |
3.92×3.92 |
1.96×1.96 |
0.98×0.98 |
0.49×0.49 |
0.196×0.196 |
0.098×0.098 |
0.75× |
2.6×2.6 |
1.3×1.3 |
0.65×0.65 |
0.325×0.325 |
0.13×0.13 |
0.065×0.065 |
||
1× |
1.96×1.96 |
0.98×0.98 |
0.49×0.49 |
0.245×0.245 |
0.098×0.098 |
0.049×0.049 |
※ Built-in ISO/ASME/EUR/GBT Standards of 2D, 3D parameters:
2D Parameters
Standard |
Parameters |
|||
ISO 4287-1997 |
Principal section |
Roughness |
Waviness |
|
Amplitude |
Pp, Pv ,Pz, Pc, Pt,Pa,Pq,Psk,Pku |
Rp, Rv ,Rz, Rc, Rt,Ra,Rq,Rsk,Rku |
Wp, Wv ,Wz, Wc, Wt,Wa,Wq,Wsk,Wku |
|
interval |
PSm,Pdq |
RSm,Rdq |
WSm,Wdq |
|
Substance |
Pmr,Pdc |
Rmr,Rdc,Rmr(Rz/4) |
Wmr,Wdc,Wmr(Wz/4) |
|
Peak |
PPc |
RPc |
WPc |
|
ISO 13565 |
ISO 13565-2 |
Rk,Rpk,Rvk,Mr1,Mr2,A1,A2,Rpk,Rvk |
||
ISO 12085 |
Roughness graph |
R,AR,R× ,Nr |
||
Waviness graph |
W,AW,W×,Wte |
|||
Other graph |
Rke,Rpke,Rvke |
|||
AMSE B46.1 |
2D |
Rt,Rp,Rv,Rz,Rpm,Rma×,Ra,Rq,Rsk,Rku,tp,Htp,Pc,Rda,Rdq,RSm,Wt |
||
DIN EN ISO 4287-2010 |
Original profile |
Pa,Pq,Pp,Pv,Pz,Pc,Pt,PSk,PKu,PSm,PPc,Pdq,Pdc,Pmr, |
||
Roughness |
Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,RPc,Rdq,Rdc,Rmr, |
|||
Waviness |
Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr |
|||
JIS B0601-2013 |
Original profile |
Pa,Pq,Pp,Pv,Pz,Pc,Pt,PSk,PKu,PSm,PPc,Pdq,Pdc,Pmr, |
||
Roughness |
Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,Rdq,Rdc,Rmr |
|||
Waviness |
Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr |
|||
GBT 3505-2009 |
Original profile |
Pa,Pq,Pp,Pv,Pz,Pc,Pt,PSk,PKu,PSm,PPc,Pdq,Pdc,Pmr, |
||
Roughness |
Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,Rdq,Rdc,Rmr |
|||
Waviness |
Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr |
3D Parameters
Standard |
Parameters |
|
ISO 25178 |
Height |
Sq,Ssk,Sku,Sp,Sv,Sz,Sa |
function |
Smr,Smc,S×p |
|
Space |
Sal,Str,Std |
|
Composite parameters |
Sdq,Sdr |
|
Volume |
Vm,Vv,Vmp,Vmc,Vvc,Vvv |
|
Form |
Spd,Spc,S10z,S5p,S5v,Sda,Sha,Sdv,Shv |
|
Functional |
Sk,Spk,Svk,Smr1,Smr2,Spq,Svq,Smq |
|
ISO 12781 |
Flatness |
FLTt,FLTp,FLTv,FLTq |
EUR 15178N |
Amplitude |
Sa,Sq,Sz,Ssk,Sku,Sp,Sv,St |
Space |
Str,Std,Sal |
|
Composite parameters |
Sdq,Sds,Ssc,Sdr,Sfd |
|
Area, Volume |
Smr,Sdc |
|
Function |
Sk,Spk,Svk,Sr1,Sr2,Spq,Svq,Smq |
|
Functional |
Sbi,Sci,Svi |
|
EUR 16145 EN |
Amplitude |
Sa,Sq,Sy,Sz,Ssk,Sku |
Mixed parameters |
Ssc,Sdq,Sdr |
|
Functional |
Sbi,Sci,Svi,Sk,Spk,Svk |
|
Space |
Sds,Std,Stdi,Srw,Srwi |
|
Hardness |
Hs,Hvol,Hv,Hps,Hpvol,Hpv,Hap,Hbp |
|
ASME B46.1 |
3D |
St,Sp,Sv,Sq,Sa,Ssk,Sku,SWt |
It is used for measurement and analysis of surface roughness and profile of precision components from industries of semi-conductor, 3C Electronics, ultraprecise machining, optical machining, micro-nano materials, micro-electro-mechanical system.
Measurement and analysis for various products, components and materials`surface form and profile characteristics, such as flatness, roughness, waviness, appearance, surface defect, abrasion,corrosion, gap, hole, stage, curvature, deformation, etc.
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